Google Tensor 3 Chip for the Pixel 8 Could Be Fabricated on Samsung’s 4nm Process Node

Google Samsung Foundry, the world’s second-largest foundry after TSMC, will commence mass production of chips using its third-generation 4nm process node. Qualcomm moved production of its Snapdragon 8+ Gen 1, Snapdragon 8 Gen 2, and forthcoming Snapdragon 8 Gen 3 to TSMC after the company experienced yield problems with its 4nm chip production last year. Follow For More Updates

Nevertheless, Samsung’s yield rates have increased from 35% at one point last year to 60% at present, as well as its performance and energy efficiency. Google’s Pixel 8 lineup, which is anticipated to launch later this year, could feature the new 4nm process node.

Google Tensor

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last year compared to 16% manufactured using the 6nm and 7nm process nodes. This year, only the iPhone 15 Pro and iPhone 15 Ultra are anticipated to be equipped with 3nm silicon.

Google’s Pixel 8 series, slated for release in the fourth quarter of this year, is anticipated to be propelled by the third-generation 4nm process node, with the Google Tensor 3 chipset for the new handsets utilizing this technology.

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The Pixel Fold, Pixel Tablet, and Pixel 7a are anticipated to be propelled by Samsung’s second-generation 4nm node-based Tensor 2 chip.

Google Tensor 3 Chip for the Pixel 8

Starting in 2019, both TSMC and Samsung intend to produce 4nm chips in the United States, with TSMC’s fab in Phoenix, Arizona and Samsung Foundry’s facility in Taylor, Texas each installing a 4nm production line.

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TSMC expects to begin shipping 2nm chips to customers in 2026, while Samsung plans to commence 2nm production in 2025 and 1.4nm production in 2027. Intel has also stated that it intends to rival TSMC and Samsung Foundry in 2024 and regain process leadership the year after. Follow For More Updates On Twitter

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